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Reliable and low temperature die attach process using Ag/Sn/Ag sandwich structure for high temperature semiconductordevices
Reliable and low temperature die attach process using Ag/Sn/Ag sandwich structure for high temperature semiconductordevices
- 제목
- Reliable and low temperature die attach process using Ag/Sn/Ag sandwich structure for high temperature semiconductordevices
- 제목 (타언어)
- Reliable and low temperature die attach process using Ag/Sn/Ag sandwich structure for high temperature semiconductordevices
- 저자
- An sung jin
- 발행일
- 2017-10-27
- 학회명
- 2017 추계 대한금속재료학회
- 개최지
- 대구 Coex