입자 패킹 공정에 대한 접촉모델별 이산요소법 해석

Analysis of Particle Packing Process by Contact Model in Discrete Element Method

초록

In many industries, particle packing is adopted quite frequently. In the particle packing process, the Discrete Element Method (DEM) can analyze the multi-collision of particles efficiently. Two types of contact models are frequently used for the DEM. One is the linear spring model, which has the fastest calculation time, and the other is the Hertz–Mindlin model, which is the most frequently used contact model employing the DEM. Meanwhile, very tiny particles in the micrometer order are used in modern industries. In the micro length order, surface force is important to decreased particle size. To consider the effect of surface force in this study, we performed a simulation with the Hertz–Mindlin model and added the Johnson–Kendall–Roberts (JKR) theory depicting surface force with surface energy. In addition, three contact models were compared with several parameters. As a result, it was found that the JKR model has larger residual stress than the general contact models because of the pull-off force. We also validated that surface force can influence particle behavior if the particles are small.

키워드

Discrete Element Method(이산요소법); Powder Packing(분체패킹); Contact Model(접촉모델)
제목
입자 패킹 공정에 대한 접촉모델별 이산요소법 해석
제목 (타언어)
Analysis of Particle Packing Process by Contact Model in Discrete Element Method
저자
유재희; 박준영
DOI
10.14775/ksmpe.2019.18.3.059
발행일
2019
저널명
한국기계가공학회지
권
18
호
3
페이지
59 ~ 65