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Die attachment on Cu plated alloy 42 and bare Culead frames using Ag/Sn/Ag transient liquid phasebonding
Die attachment on Cu plated alloy 42 and bare Culead frames using Ag/Sn/Ag transient liquid phasebonding
- 제목
- Die attachment on Cu plated alloy 42 and bare Culead frames using Ag/Sn/Ag transient liquid phasebonding
- 제목 (타언어)
- Die attachment on Cu plated alloy 42 and bare Culead frames using Ag/Sn/Ag transient liquid phasebonding
- 저자
- An sung jin
- 발행일
- 2017-02-18
- 학회명
- 18th International Symposium on Eco-materials Processing and Design
- 개최지
- 일본 오키나와
- 개최국가
- 일본