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Die Attachment on Cu Plated Alloy42 and Bare Cu Lead FramesUsing Ag/Sn/Ag Transient Liquid Phase Bonding
Die Attachment on Cu Plated Alloy42 and Bare Cu Lead FramesUsing Ag/Sn/Ag Transient Liquid Phase Bonding
- 제목
- Die Attachment on Cu Plated Alloy42 and Bare Cu Lead FramesUsing Ag/Sn/Ag Transient Liquid Phase Bonding
- 제목 (타언어)
- Die Attachment on Cu Plated Alloy42 and Bare Cu Lead FramesUsing Ag/Sn/Ag Transient Liquid Phase Bonding
- 저자
- An sung jin
- 발행일
- 2017-04-28
- 학회명
- 2017 춘계 대한금속재료학회
- 개최지
- 창원컨벤션센터
- 개최국가
- 대한민국